Connectivity, self-optimizing processes, automation – Industry 4.0 demands new solutions, and the Cheetah EVO delivers, helping increase speed, image quality, and efficiency in the SMT and semiconductor industry, as well as in laboratories.
Cheetah EVO highlights
- Fast and intuitive scan set-up
- High detail resolution at submicron level for 2D, 2.5 D and 3D imaging
- Best-in-class laminography
- Automated inspection programs and software-assisted image review
- Dose monitoring for sensitive parts
- Optional high load capacity (≤20 kg)
- Seamlessly integrated 3D visualization
with optional AI-powered image analysis
New optional water-cooled FXT 160.51 X-ray tube
Inspectors know the problem: long scan times often lead to image distortions and question test repeatability due to labile results. It's an effect caused by the rising temperature of the tube housing and the target, which can lead to focal spot drift. The new water-cooled X-ray tube counteracts this phenomenon. It provides reliable heat dissipation and ensures a stable focal spot and crystal-clear X-ray images even after long beam times. You achieve reliable inspection results for the first scan just as for the umpteenth and can rely on the repeatability of the X-ray inspection at any time.
See more of Cheetah EVO in the gallery:
Laminography scanning of IC´s
Circuit board inspection
X-ray tube with water-cooling
Analysis of an Integrated Circuit (IC) with a computed laminography scan
Smart workflows and
visualization
The Cheetah EVO responds to the need for improved, automated operation with integrated workflows in the FGUI operating software. 3D volumes once acquired and reconstructed are brilliantly visualized using Dragonfly 3D View. They
can be analyzed with Dragonfly 3D World, which takes advantage of an AI-powered image processing algorithm. Both Dragonfly software solutions offer the ability to render 3D cinematic images with a preset selection using application-specific look-up tables resulting in the most realistic, vivid visualization.
Future-ready to meet the demands of Industry 4.0
In today’s smart factory, everything revolves around connectivity and self-optimizing processes. Industry 4.0 demands for quality control systems that offer improved automated inspections and can become an integral part of the production line. Based on customer input, Comet Yxlon upgraded the Cheetah EVO system with advanced features that help manufacturers reach new heights in speed, image quality, reliability, and repeatability.
Easy meets advanced: visual inspection of 3D volumes with Dragonfly 3D View
Dragonfly 3D View is our all-in-one software tool for the visual inspection of 3D volumes. Thanks to its user-friendly design and blazing-fast startup times, operators can create stunning, professional-grade animations fast and with ease.
Dragonfly 3D World: next-level 3D visualization and analysis – powered by AI
Dragonfly 3D World is our comprehensive software for 3D visualization and quantitative defect analysis workflows, which helps find cracks, open solder joints, delamination, or voids in electronic components like SMT. Equipped with an advanced AI-based segmentation engine, it enables X-ray inspections without the need for human intervention.
SMT inspections: grand performance for small devices
Due to the continuous miniaturization of electronic components, more and more features must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cheetah EVO features:
Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes
Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy failure analysis – resulting in substantial cost-savings compared to micro sectioning
Automatic void calculation with VoidInspect CL or DR, the laminography- or radiscopy-based inspection workflows enabling the rapid non-destructive analysis of voids inside the solder joints of board components
ProInspect THTInspect DR, the semi-automated defect analysis for fill level inspections on THT-based components in 2D
Optional high load capacity (< 20 kg) with reinforced table and mechanics: Several parts and electronic interconnects in fixed packages can be inspected at once – a real-time saver
Cheetah EVO SMT applications
- PCB
- BTC
- BGA
- LGA
- QFN/QFP
- THT
- IGBT
- LED
Semicon inspections: maximum resolution at minimum voltage
Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, testing requires maximal image resolution at low power and low voltage. Void compilations, including multi-area voiding, need accurate, repeatable inspection routines. The Comet Yxlon Cheetah EVO offers:
- Highly sensitive detector with optional low dosage mode
- High detail recognition through an integrated image chain
- Integrated, automatic defect detection with FGUI (e.g. voids in bumps)
Cheetah EVO semiconductor applications
- Wafers and integrated circuits (IC)
- Die attach connections
- 3D IC joints
- TSV
- Sensors
- MEMS and MOEMS
Laboratory inspections: leading technology for precise analysis
The inspection of electronic components during research and development is highly complex and requires a broad range of features. Computed tomography with the Comet Yxlon Cheetah EVO is the technology of choice for detailed analyses of micro components such as those used in batteries, connectors, and medical devices.
Exceptional CT quality due to a range of highly sensitive detectors with excellent contrast-to-noise ratio
Realistic, vivid visualization by Comet Yxlon FF CT software, integrated with the FGUI user interface workflows with individual 3D cinematic renderers, artifact reduction, and a preset selection of transfer functions (TF)
Cheetah EVO lab applications
- Batteries
- Connectors
- Various hard-to-see electronics components
- Medical material
- Military and space electronics
Technical Data
| Sample Size | 800 x 500 [mm] (31'' x 19'') |
| Max. Radioscopic Area | 460 x 410 [mm] (18'' x 16'') |
| System Dimensions (W/D/H) | 1650 x 1400 x 2050 [mm] |
| System Weight | 2200 kg |
| FeinFocus X-ray Tube | FXT-160.50 Microfocus or FXT-160.51 Multifocus, 20 - 160 kV voltage range |
| Pixel Matrix | 1004 x 620 px (Flat-panel detector 1308), 1004 x 1004 px (Flat-panel detector 1313), 1276 x 1276 px (Flat-panel detector 1616) |
| Pixel Pitch | 127 µm |
| Bit Depth | 16 bit |
| Oblique Viewing | +/- 70° (140°) |
| 3D Modes | Laminography (micro3Dslice), CT QuickScan, QualityScan |
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