From inspecting complete wafers to identify voids within TSVs, to scanning 3D ICs for solder bump metrology, Comet Yxlon provides high-tech X-ray inspection solutions that add extra performance to crucial steps along your process development and production chain.
The semiconductor market is driven by progress at lightning speed, and staying ahead of the game means investing in a comprehensive inspection strategy. Our portfolio of X-ray inspection solutions, powered by Dragonfly AI software, can be a critical support to reduce cost, shorten time-to-market and increase yield.
Whether you are diving deep into root-cause analysis within the lab, or searching for automated solutions that slot right into your fab production line, our X-ray systems now cover the most crucial production phases, from wafer processing to chip packaging.
IC packaging: From traditional to advanced packaging
Driven by the need for smaller and more powerful chips, microchip packaging has seen revolutionary changes in recent years. While in traditional packaging single silicon dies are attached to substrates by wire bonding or solder bonding (e.g., with solder balls of 350-500 µm size) in one plane, advanced packaging allows multiple dies to be connected using silicon substrates and redistribution layers and packaged together as a single electronic device. This leads to smaller solder bump sizes (e.g., 50-100 µm C4 bumps and 10 µm micro-bumps) in a three-dimensional arrangement which requires an extra diligent inspection from a perspective that only computed tomography (CT) and computed laminography (CL) can provide.
X-ray for semiconductors:
What makes it a game-changer?
2.5D and 3D X-ray inspection bridge the gap between speed and visibility – giving semiconductor manufacturers unprecedented insight into the internal health of devices without destructive methods. But how do these technologies work?
2.5D X-ray
2.5D X-ray combines multiple-angled images to give depth-like information (a “pseudo-3D” view). By offering better depth discrimination without the full computational cost of 3D, it is ideal for inline inspection where speed matters.
Screenshot taken from our TSV Insights X 2.5D software. Image shows a wafer sample (source: Fraunhofer IZM-ASSID) where all TSVs have been manipulated to contain voids. The image shows the segmentation of eachTSV (yellow) and the voids within (red).
3D X-ray (CT)
3D X-ray (CT or computed tomography) reconstructs a true volumetric image of the sample. It allows engineers to slice through the component virtually and inspect each layer, revealing hidden internal features with high precision – essential for advanced packaging and failure analysis.
3D X-ray image of micro-bumps within a CPU. Captured by the CA20 and rendered in Dragonfly 3D World.
What's your inspection challenge?
Frontend: TSV in wafers
Improve your wafer development and production by implementing X-ray inspection at crucial process steps - our inspection solutions are tailored to analyse complete wafers, coupons and dies, and determine critical defects within your TSVs, in the lab or directly intergrated into the fab line.
Backend: Solder Bumps in
Packaged Chips
Gain critical insights during die attach process development and production – with crystal-clear images of submicron details within solder bumps, identifying critical defects like head-in-pillow, solder bump shift, voids and more.
Looking for an impression you can take with you?
Download our exclusive semiconductor brochure below for a concise explanation of our technology and it's potential applications in the field of semiconductors. from wafer quality inspection to full 3D analysis of advanced packaging.
Semiconductor Inspection with X-ray (pdf)
AI-powered Insight
Powered by Dragonfly
Our Comet Yxlon inspection systems are equipped with the advanced 3D visualization and analysis software from Dragonfly – a Comet brand. As an innovative company with roots in science and research, Dragonfly has been at the forefront of AI development for 20 years.
Their core product, Dragonfly 3D World, uses a machine learning based segmentation engine to extract powerful qualitative and quantitative findings from images with ease. Together, Dragonfly and Comet Yxlon created powerful software packages, tools and features especially for the challenges and automation needs of the semiconductor industry.
Our semiconductor software packages like TSV Insights X 2.5D and CoS Insights X 3D are exclusively availabe with Comet Yxlon systems.
2D slice taken from a CT scan of a commercially available GPU. Dragonfly technology has been used to identify and segment solder bumps (yellow), voids (red) and bridges (purple).
Systems and configurations for all your challenges
CA20
Now available as a fully-automated inspection solution for Advanced Packaging, the CA20 is designed to deliver superior 2D & 3D images in the highest resolution, and helping identify structural defects in solder bumps and TSVs fast.
FF35 CT
With its optional dual-tube set-up, the FF35 CT combines unprecedented CT data quality with the highest versatility, particularly in lab environments. With specific variants developed specially for inspections in semiconductor-related industries, the FF35 CT SEMI is certified to the industry standards SEMI® S2-0818 & SEMI® S8-0218
Cheetah EVO & Cougar EVO
High detail resolution and very flexible X-ray systems for 2D/2.5 D, 3D laminography
and computed tomography imaging. For R&D and at-line inspection in traditional packaging
environments. Our Cheetah EVO Semi is SEMI® S2-0818 & SEMI® S8-0218 certified
Want to get to know our products up-close and personal?
The best way to keep up to date with our evolving inspection solutions is to get to know our team, either at an event near you, or contact us via the contact form.
Upcoming Events
- SEMICON Japan
📆 17-19 December 2025
📍 Tokyo Big Sight
🎪 West Hall, Booth #1969