From single die traditional packages to wafers and advanced packaging devices – Comet Yxlon supplies manufacturers with X-ray inspection systems that meet the high standards of semiconductor quality control.
Quality testing of microchips and wafers
According to Moore's popular law, the number of transistors in a dense integrated circuit (IC) doubles every 18 to 24 months. Following the trend towards miniaturization, more and more functions must be fitted in the same space to save silicon area. As the microchip becomes more complex, so do the requirements concerning quality inspections. Comet Yxlon offers high-resolution and high-magnification X-ray inspection systems that were engineered to meet the challenges of IC and wafer testing.
IC packaging: From traditional to advanced packaging
Driven by the need for smaller and more powerful chips, microchip packaging has seen revolutionary changes in recent years. While in traditional packaging single silicon dies are attached to substrates by wire bonding or solder bonding (e.g., with solder balls of 350-500 µm size) in one plane, advanced packaging allows multiple dies to be connected using silicon substrates and redistribution layers and packaged together as a single electronic device. This leads to smaller solder bump sizes (e.g., 50-100 µm C4 bumps and 10 µm micro-bumps) in a three-dimensional arrangement which requires an extra diligent inspection from a perspective that only computed tomography (CT) and computed laminography (CL) can provide.
Checking connections between silicon dies and substrates
Whether it concerns electrical connections for information transport, thermal connections to dissipate heat, or connections via solder bumps and TSVs (through-silicon via) conductivity must be ensured, and short circuits must be avoided. Voids do not only affect the solder joint mechanically, as cracks can propagate at this point, but also affect the electrical and thermal conductivity of the element. Quality inspections with Comet Yxlon X-ray systems help semiconductor manufacturers to identify and quantify voids at incredible speed.
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Speed up your process development with 3D X-ray
While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. Comet Yxlon's non-destructive testing (NDT) systems, such as the CA20 supply you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. See critical defects such as non-wet, head-in-pillow or bump shift and determine the stand-off height to monitor die tilt or warping.
From lab to fab.
Whether you need the highest quality images to inspect your parts in a Lab/R&D environment, or you require a fully-automated solution that easily fits into your existing production process, Comet Yxlon offers a variety of systems and onfigurations to suit your needs.
Small batch inspection & failure analysis.
While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. Quickly ramp-up your interconnects process and find flaws fast with feedback gained from 3D images within minutes.
Explore CA20Fully-automated inspection.Â
CA20 is our smart 3D X-ray inspection solution - for the fab. With a fully automatic loader and assisted defect recognition software, the CA20 is designed to complement your production line with consistent, fast and accurate 3D X-ray inspection.
Explore CA20Looking for an impression you can take with you?
Download our exclusive semiconductor brochure below for a concise explanation of our technology and it's potential applications in the field of semiconductors. from wafer quality inspection to full 3D analysis of advanced packaging.
Semiconductor Inspection with X-ray (pdf)
Software and workflows for automated inspection
From software tools that rapidly detect and analyze the size and severity of defects, such as voids, solder bump misalignments, and head-in-pillow issues, to solutions that ensure delicate components remain shielded from harmful X-rays, our systems are equipped with a range of advanced software solutions across our three pillars of Clarity, Efficiency and Insights. Explore just a few of these below.
- The CoS 3D Clarity package as part of our award-winning Geminy software is your tool to quickly create high resolution 3D images.
- Use our Batch Manager to inspect trays of ICs or substrate strips with a few clicks.
- Protect your sensitive inspection parts from critical X-ray doses with the Dose Manager.
Software Spotlight: CoS Insights X 3D
CoS Insights X 3D is our specialised software for the CA20 equipped with a fully-automated inspection package, including EFEM loader for IC trays from magazine. It provides fast, sufficient quality 3D image acquisition, and fully automated 3D bump metrology and defect recognition including reporting for automated processing.
- Speed up time to market and time to volume with real-time feedback, and ship zero defects by identifying developing trends early
- Improve yield by process control based on accurate and reliable automated 3D metrology information and increase productivity due to fully automated 24/7 inspections
- Extracted information is also available in machine readable form for post reporting jobs, e.g. json, xml and direct access reports can be automatically transferred to your preferred local storage location
*CoS Insights X 3D is available in combination with the automatic loader
Compliant with SEMI S2 safety standard
To ensure a global safety standard, the semiconductor equipment industry developed the SEMI S2 guidelines. They cover a wide range of health and safety requirements, such as regulatory requirements, electrical and chemical hazards, safety shutdown, and exhaust specifications. Comet Yxlon inspection systems FF35 CT SEMI and Cheetah EVO SEMI (on request) are fully compliant with the SEMI S2 standard.
Have we caught your interest?
The best way to keep up to date with our evolving inspection solutions is to get to know our team, either at an event near you, or contact us via the contact form.