X-ray inspections at wafer level allow manufacturers to measure critical attributes and to identify defects early in the production process. During process development, Comet Yxlon solutions enable root cause analysis of TSVs on coupons or dies, accelerating new product introduction. In wafer production, automated defect recognition helps increase yield and reduce waste.
Checking connections between silicon dies and substrates
Whether it concerns electrical connections for information transport, thermal connections to dissipate heat, or connections via solder bumps and TSVs (through-silicon via) conductivity must be ensured, and short circuits must be avoided. Voids do not only affect the solder joint mechanically, as cracks can propagate at this point, but also affect the electrical and thermal conductivity of the element. Quality inspections with Comet Yxlon X-ray systems help semiconductor manufacturers to identify and quantify voids in substrates and dies at incredible speed.
A 2D Slice taken from a 3D X-ray (CL) scan of a wafer sample (source: Fraunhofer IZM-ASSID) where all TSVs have been manipulated to contain voids.
Gain critical metrological insights into your TSVs with X-ray inspection.
A single wafer can contain thousands or even millions of TSVs, tightly packed together and nearly identical in size and shape. Segmenting these individual elements and determining their position on the wafer in a consistent, reliable and efficient manner presents a significant challenge –That's whereour 2.5D and 3D X-ray technologies comes in.
Process Development
- Assessment of TSV dimensions, voids, fill level and more with CT
- Inspection of complete wafers, coupons or dies
- Highest precision on submicron level
- Real-time metrology
- Speeding up new product introductions
Wafer Production
- Identification and quantification of TSV dimensions, voids and more in complete wafers
- Fully integrated inline inspection including clean-room requirements
- Completely automated, AI-powered inspection of wafers in high volume production
- Increased yield with valuable process insights
- 2.5D X-ray for incredible speed and throughput
Featured software: TSV Insights X 2.5D
TSV Insights X 2.5D is our specialised software for the CA20 equipped with a fully-automated inspection package specifically designed for wafer level packaging. It provides fast, sufficient quality 2.5D image acquisition, and fully automated TSV metrology and defect recognition including reporting for automated processing.
- Speed up time to market and time to volume with real-time feedback, and ship zero defects by identifying critical defects early
- Improve yield by process control based on accurate and reliable automated TSV metrology information and increase productivity due to full integration into your production chain
- Extracted information is also available in machine readable form for post reporting jobs, e.g. KLARF, json, xml and direct access reports can be automatically transferred to your preferred local storage location
before segmentation
after segmentation
Explore our inspection solutions
CA20 is designed to deliver superior 2D & 3D images in the highest resolution, helping identify structural defects in solder bumps and TSVs fast.
Explore moreCA20
The FF35 CT combines unprecedented CT data quality with the highest versatility, particularly in lab environments.
ExploreFF35 CT
High detail resolution and flexible X-ray systems for 2D/2.5 D, 3D laminography and computed tomography imaging in traditional packaging environments.
ExploreCheetah EVO
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The best way to keep up to date with our evolving inspection solutions is to get to know our team, either at an event near you, or contact us via the contact form.
Upcoming Events
- SEMICON Japan
📆 17-19 December 2025
📍 Tokyo Big Sight
🎪 West Hall, Booth #1969