On the chip level, X-ray shows its strengths especially in miniaturized devices and advanced packaging, delivering insights into submicron-size details. In the lab, Comet Yxlon solutions help to analyse critical attributes in IC packages fast, speeding up time-to-market. During high-volume production, they facilitate a completely automated, AI-powered inspection.
IC packaging: From traditional to advanced packaging
Driven by the need for smaller and more powerful chips, microchip packaging has seen revolutionary changes in recent years. While in traditional packaging single silicon dies are attached to substrates by wire bonding or solder bonding (e.g., with solder balls of 350-500 µm size) in one plane, advanced packaging allows multiple dies to be connected using silicon substrates and redistribution layers and packaged together as a single electronic device. This leads to smaller solder bump sizes (e.g., 50-100 µm C4 bumps and 10 µm micro-bumps) in a three-dimensional arrangement which requires an extra diligent inspection from a perspective that only computed tomography (CT) and computed laminography (CL) can provide.
A 2D Slice taken from a 3D X-ray (CL) scan of a commercially available GPU.
3D metrology for solder connections.
As a non-destructive testing (NDT) system, inspection solutions such as the CA20 supplies you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. 3D X-ray produces high-resolution 3D volumes that allow manufacturers to measure and inspect bumps and identify smallest defects in record time. See critical defects such as non-wet, head-in-pillow or bump shift and determine the stand-off height to monitor die tilt or warping like never before.
Process Development
- Crystal-clear 3D images of submicron details within seconds
- 3D metrology data available for bump size, stand-off height, head-in-pillow ratio, shift length, void area in solder bumps
- Fast and accurate analysis of critical defects for direct process feedback
- Suitable for traditional or advanced packaging
- Accelerated development with AI-powered insights speeding up
time-to-market
Chip Production
- Completely automated, AI-powered inspection of IC packages in high volume production
- Full integration into the production line including clean-room requirements
- Optimized for production process monitoring and quality assurance
- Cost-saving process improvements through production insights
Featured software: COS Insights X 3D
CoS Insights X 3D is our specialised software for the CA20 equipped with an EFEM loader. It provides fast, sufficient quality 3D image acquisition, and fully automated 3D bump metrology and defect recognition including reporting for automated processing.
- Speed up time to market and time to volume with real-time feedback, and ship zero defects by identifying developing trends early
- Improve yield by process control based on accurate and reliable automated 3D metrology information and increase productivity due to fully automated 24/7 inspections
- Extracted information is also available in machine readable form for post reporting jobs, e.g. json, xml and direct access reports can be automatically transferred to your preferred local storage location
Explore our inspection solutions
CA20 is designed to deliver superior 2D & 3D images in the highest resolution, helping identify structural defects in solder bumps and TSVs fast.
Explore moreCA20
The FF35 CT combines unprecedented CT data quality with the highest versatility, particularly in lab environments.
ExploreFF35 CT
High detail resolution and flexible X-ray systems for 2D/2.5 D, 3D laminography and computed tomography imaging in traditional packaging environments.
ExploreCheetah EVO
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The best way to keep up to date with our evolving inspection solutions is to get to know our team, either at an event near you, or contact us via the contact form.
Upcoming Events
- SEMICON Japan
📆 17-19 December 2025
📍 Tokyo Big Sight
🎪 West Hall, Booth #1969