By leveraging advanced computed laminography and integrated AI technology, Comet Yxlon brings high-resolution 3D X-ray capabilities to the forefront for detailed testing in the advanced packaging of integrated circuits. For the first time, the semiconductor market now has a non-destructive supplement or alternative to conventional destructive methods. Three-dimensional X-ray images with a resolution of less than 1 µm can reliably identify typical defects in 3D IC solder connections, such as missing and bridged bumps, voids, non-wet, head-in-pillow, bump shift, and deviations in standoff height or deformations. Modern analysis software based on deep learning takes over the automatic evaluation, including report generation according to the user's requirements. The new CA20 X-ray inspection system, therefore, offers the semiconductor industry a whole new level of safety and efficiency.

"As an accompanying inspection method already in research and development of new microchips and their production processes, the new CA20 will revolutionize the semiconductor industry," said Christian Driller, Vice President R&D at Comet Yxlon. "CA20 will ensure that ramp-up processes and time-to-market are dramatically accelerated, the current high scrap rate will get reduced, and yield will thus significantly increase. The system brings the zero-defect goal within reach."

Yesterday afternoon, Comet Yxlon officially launched the system with live demonstrations and invited guests. During various presentations at the conference, Stephan Haferl (CEO Comet), Dionys van de Ven (President Comet Yxlon), Isabella Drolz (Vice President Product Marketing Comet Yxlon) and Christian Driller had already referred to that momentous event before. The new stand positioning in Hall B2, shared by productronica and Semicon Europa side by side, indicates where Comet Yxlon's journey is heading: The tiniest errors are the biggest challenges in today's world, and Comet Yxlon makes them visible with its technology in line with its promise: 'See better. Faster. More.’

Hall B2, booth 454