Access the wealth of information included in your 2D and 3D images to improve both your product and process quality. Our Software Suite’s packages and tools support you in staying ahead of your market.
Extract critical information for enhanced product and process quality
From segmentation and visualization to evaluation and quantification: The Comet Yxlon Software Suite includes powerful software tools and packages that allow you deepest insights into your product and process quality. Analyse properties and characteristics of your manufactured products based on human-machine or machine-to-machine-interfaces, and gain actionable information about your process from deviations of product quality.
Expert software tools for more insights
Do you want to explore how deep you can dive into image and process analysis? Our comprehensive software tools for experts combine advanced AI and machine learning processes to deliver powerful, actionable insights into product and process quality.
Our Insight software tools
before segmentation
after segmentation
Screenshot taken from our TSV Insights X 2.5D software. Image shows a wafer sample (source: Fraunhofer IZM-ASSID) where all TSVs have been manipulated to contain voids. The image shows the segmentation of eachTSV (yellow) and the voids within (red).
TSV Insights X 2.5D
Powered by Dragonfly
TSV Insights X 2.5D is our specialised software for the CA20 equipped with a fully-automated inspection package specifically designed for wafer level packaging. It provides fast, sufficient quality 2.5D image acquisition, and fully automated TSV metrology and defect recognition including reporting for automated processing.
- AI powered deep-learning segmentation for precise TSV defect detection on wafer inspection
- Speed up time to market and time to volume with real-time feedback, and ship zero defects by identifying critical defects early
- Improve yield by process control based on accurate and reliable automated TSV metrology information e.g. TSV dimension, void dimension and location, and increase productivity due to full integration into your production chain
- Extracted information is also available in machine readable form for post reporting jobs, e.g. KLARF, json, xml and direct access reports can be automatically transferred to your preferred local storage location
*TSV Insights X 2.5D is available in combination with the automatic loader
CoS Insights X 3D
Powered by Dragonfly
CoS Insights X 3D is our specialised software for the CA20 equipped with a fully-automated inspection package, including EFEM loader for IC trays from magazine. It provides fast, sufficient quality 3D image acquisition, and fully automated 3D bump metrology and defect recognition including reporting for automated processing.
- Speed up time to market and time to volume with real-time feedback, and ship zero defects by identifying developing trends early
- Improve yield by process control based on accurate and reliable automated 3D metrology information and increase productivity due to fully automated 24/7 inspections
- Extracted information is also available in machine readable form for post reporting jobs, e.g. json, xml and direct access reports can be automatically transferred to your preferred local storage location
*CoS Insights X 3D is available in combination with the automatic loader
CoS Insights
Powered by Dragonfly
Increased productivity by 3D metrology of Chip-on Substrate solder connections:
- Speed up process development and failure analysis with fast, valuable insights and CoS 3D Clarity scans for bumps down to 50 µm.
- Ensure quality and control by learning crucial parameters, detecting defects like Head-in-Pillow, and obtaining objective, reproducible results.
- Efficient setup for single parts and small batches, with automated sequence programming and tools for comprehensive 2D and 3D inspections.
- Results available in both PDF and machine-readable forms
CoS Insights also includes the tools for software-assisted void analysis and visual inspection.
Void Insights
Gain even deeper insights from efficient guided inspection by grading solder connection voids. Our Void Insights package enables the software-assisted quantitative void analysis in 2D and 3D images. You’ll benefit from unobstructed views of solder planes when using 3D X-ray. Void Insights allows a reliable and repeatable evaluation with a machine-readable export of results.
Review Insights
Our Review Insights package enables the software-assisted visual inspection of 2D and 3D images. It allows you to review slices of 3D volumes in any direction and facilitates image analysis through user-friendly image filters, zoom, rulers and manipulation.
CoS Insights X 3D and CoS Insights is available on the following systems, click on the links below to find out more:
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Battery Insights
Powered by Dragonfly
From segmentation to automated overhang measurements – Battery Insights, our new Dragonfly battery software package makes CT inspections of batteries as easy, fast, and efficient as never before. The innovative Dragonfly battery solution is based on an expert-trained deep learning (DL) model which gets customized to your exact requirements. The built-to-spec AI-powered package performs exact measurements and evaluations and delivers detailed reporting according to your individual needs. Eliminate operator bias from your battery inspections, benefit from a turnkey solution adapted to your specs, and unlock the power of smart automation with Dragonfly!
Dragonfly 3D World
Experience image processing on a completely new level with Dragonfly 3D World. Based on advanced AI and machine learning processes, the user-friendly Dragonfly software can vastly improve image and process analysis. From segmentation to visualization – learn more about the tools of scientific image processing in our Dragonfly 3D World section.
Quantitative Analysis
Size, shape, and spatial properties
Make measurements on hundreds to millions of individual grains, pores, organelles, etc. Select from volume, surface area, Ferret diameter, aspect ratio, roughness, sphericity and scores of additional measurements.
Porous media
Dragonfly provides the ideal framework for characterizing and analyzing the properties of porous materials.
Meshes and models
Create high-quality meshes, vector fields, and spatial graphs generated from image data, segmentations, or simulations.
Fiber analysis
Calculating the physical properties of composites, polymers, and fibrous materials with Dragonfly provides researchers and product developers with the comprehensive understanding of material behavior that is essential for improving and developing new products.
Dragonfly 3D World is available on the following systems, click on the links below to find out more:
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