SEMICON Europa/electronica - November 2024 in Munich, Germany

SEMICON Europa / electronica is the leading exhibition for the microelectronics industry in Europe. It brings together professionals, innovators, and decision-makers from across the semiconductor supply chain. The event showcases the latest advancements in semiconductor technology, materials, and equipment, while also offering insights into emerging trends like AI, IoT, and smart manufacturing. With a focus on networking, collaboration, and knowledge sharing, this conference is where the industry’s future is shaped.

When?

12 - 15 November, 2024

Where?

Munich Exhibition Hall, Germany

Booth

Hall: C2, Booth: 555

Don't let systematic defects hold you back!
Our smart 3D X-ray inspection solution - for the fab - is coming soon to SEMICON Europa!

This year at SEMICON Europa, we are excited to present our new inspection solution tailor-made for the fab. By detecting systematic defects fabulously fast, it will accelerate your time-to-market and time-to-volume significantly – and thus boost your yield.

We look forward to welcoming you in Munich! 

Tuesday Nov 12th
1:45 PM
Booth C2.555

Get to know CA20!
Submicron 3D X-ray for Advanced Packaging. 

The CA20 is designed to deliver superior 2D & 3D images in the highest resolution, it allows the fastest inspection of micron-sized details – and helps cut time to market for complex 3D ICs.

  • Designed for the semiconductor industry
  • Non-destructive technology for three-dimensional insights into solder bumps within minutes
  • Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
  • Efficient software-assisted review including automated void analysis with Void Insights
  • Dose Manager for the protection of X-ray sensitive components

Speed up your process development with 3D X-ray

While inspections using destructive methods can take weeks, 3D X-ray gives your R&D engineers results they can work with right away. As a non-destructive testing (NDT) system, the CA20 supplies you with crystal-clear 3-dimensional images of nano details inside your ICs within minutes. Monitor your interconnects process, find flaws fast and feed your insights back into the process.

Identification of critical Advanced Packaging defects

3D X-ray produces high-resolution 3D volumes that allow manufacturers to measure and inspect bumps and identify smallest defects in record time. See critical defects such as non-wet, head-in-pillow or bump shift and determine the stand-off height to monitor die tilt or warping like never before.

Planning to join? We may have tickets available!

Simply reach out via the form below and if eligible, our sales representative will respond if tickets are available. Once you register your details you will receive a free ticket to the main exhibition. Make sure to visit us on our booth to speak to our friendly team on-site.

This form collects your personal data, which we need to respond to your request. The protection of your personal data is important to us. Please read our privacy policy to understand how we protect and manage the data you submit.