In the “More than Moore” era, the package with its multiple semiconductor dies becomes a core determinant of system performance. While the complexity of Advanced Packaging designs is constantly increasing, so is the pressure on IC manufacturers: The zero-defect production of new, high-performance components is vital in the fast-moving market. As an innovative non-destructive inspection solution, Comet Yxlon’s new CA20 supports the IC production by accelerating both time-to-market and time-to-volume and by providing real-time process feedback to increase yield.

To address costly structural yield issues before they settle into the production process, the new CA20 supplies manufacturers with automatic 3D metrology powered by a modern analysis software based on AIthat supplies detailed results data for the individual bumps within minutes as input to process control of the die attachement step.. The new EFEM loader is an additional feature that speeds up automated operation in the fab under cleanroom conditions.

With the next generation of the CA20 inspection solution, Comet Yxlon has taken 3D X-ray technology for the Advanced Packaging industry to a whole new level. Software packages such as Dose Manager, Batch Manager and 'Chip-on-Substrate Insights' for automated 3D metrology ensure accuracy, reliability, and efficiency for all inspection tasks. All functions are easily and intuitively accessed via the proven Geminy user interface.

 Yesterday afternoon, Comet Yxlon officially launched the new solution with live demonstrations and invited guests at Semicon Europa. During their presentation at the trade fair, Stephan Haferl (CEO Comet), Dionys van de Ven (President Comet Yxlon) and Isabella Drolz (Vice President Marketing & Product Strategy Comet Yxlon) reaffirmed where Comet Yxlon is heading, according to its promise 'See better. Faster. More.’